| 全部作者 | 陳健忠 |
|---|---|
| 作者順序 | 第二作者 |
| 論文名稱 | Distribution of polishing times for a wafer with different patterned polishing pads during CMP and CCMP |
| 刊物名稱 | Surface & Coatings Technology |
| 出版日期 | 2010-07-01 |
| 全部作者 | 陳健忠 |
|---|---|
| 作者順序 | 第二作者 |
| 論文名稱 | Distribution of polishing times for a wafer with different patterned polishing pads during CMP and CCMP |
| 刊物名稱 | Surface & Coatings Technology |
| 出版日期 | 2010-07-01 |