| 全部作者 | 陈健忠 |
|---|---|
| 作者顺序 | 第二作者 |
| 论文名称 | Distribution of polishing times for a wafer with different patterned polishing pads during CMP and CCMP |
| 刊物名称 | Surface & Coatings Technology |
| 出版日期 | 2010-07-01 |
| 全部作者 | 陈健忠 |
|---|---|
| 作者顺序 | 第二作者 |
| 论文名称 | Distribution of polishing times for a wafer with different patterned polishing pads during CMP and CCMP |
| 刊物名称 | Surface & Coatings Technology |
| 出版日期 | 2010-07-01 |